As an Advanced Packaging Technology Process Integration Engineer, be part of an exciting team working on cutting-edge advanced packaging process technologies. Develop and validate module process and integrate the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and Integration process flow development to make sure projects are completed successfully and delivered on time.
Responsibilities:
Work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
Responsible for developing advanced 2.5D and 3D SiP MEOL and assembly flows
Module process, Measurement & Inspection to validate each process in integration
Develop various packaging processes to complete process design kit (PDK) components
Manage complex technical programs and teams leading to timely development of products.
Interface with internal module process development, layout, package architecture, package design teams and with external suppliers, foundries, and OSATs for the development and realization of advanced packaging solutions
Requirements:
Master Degree or Bachelor Degree in Electrical, Mechanical, or Materials Science Engineering
Good understanding on Advanced Packaging architecture and process flow
Experience on MEOL & Packaging Assembly Process Integration
Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.)
Experience and Knowledge on various packaging technologies such as wire-bonding, flip-chip, camera-module assembly, molding, singulation, WLCSP, MCMs, and SiP
Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies
Good understanding on design manual, design rules, generation rules, parasitic extraction and PDK development associated workflow
Minimum 5 years of experience in semiconductor packaging/assembly/BEOL
Willing to tackle tough problems and enjoys problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies
Qualifications
Education:
Bachelor's Degree
Skills:
Certifications:
Languages:
Years of Experience:
7 - 10 Years
Work Experience:
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
