Lightmatter builds chips for artificial intelligence computing. Our architecture leverages the unique properties of light to enable fast and efficient inference and training engines. If you're a collaborative engineer or scientist with a passion for innovation, solving challenging technical problems, and doing impactful work like building the world's first optical computers, consider joining the team at Lightmatter
We just raised $155 million in an extended Series C financing round led by GV (formerly Google Ventures) and Viking Global Investors. This round comes after a previous $154 million raised in May 2023. Lightmatter has accumulated over $420 million in funding. We have created a unique and open culture, currently with 150 employees working together to power the future of computing.
In this role, you will be responsible for advanced packaging and system level quality and validation of next-generation Lightmatter products. You will be expected to develop product specific packaging, system quality, reliability and validation test plans for products from development to high volume manufacturing. It also involves engaging with silicon design, digital verification, software, packaging and system platform engineering teams to influence the definition of the product and to leverage the capabilities of the ecosystem from a quality and reliability perspective. You will also be setting up validation capabilities and carrying out validation tests. You will be expected to support customer deployment and related technical issues.
Responsibilities
- Lead overall quality and reliability strategies and plans for our highly integrated photonics-based AI platform and our photonics chiplet communication fabric.
- Define quality criteria of product life cycle from pre-silicon, post silicon, qualification and high-volume manufacturing.
- Partner closely with silicon engineering, test engineering, packaging and system engineering groups to understand reliability failures/issues and develop mitigation plans.
- Experience in reliability models and failure mechanisms such as the Arrhenius model are a plus.
- Work closely with internal and external laboratories for quality and reliability tests to support product development, qualification, and EFA/PFA.
- BS or higher degree in Electrical Engineering, Physics, Materials Engineering/Science, Mechanical Engineering or other related fields
- At least 8 years of industry experience and at least 5 years of quality and reliability on silicon and packaging areas
- Good understanding and experience in defining device reliability spec including HTOL, ES/LU and package qualification like BHAST, HTHH, TC etc.
- Ability to define reliability requirements given the product specs and final use condition
- Good understanding of device physics and failure mechanism in Serdes/digital/mixed signal IC’s
- Experience in failure analysis techniques such as FIB/SEM, TEM, LVI etc
- Good statistical data analysis skills to analyze pre vs post reliability data.
Preferred Requirements
- Good understanding of packaging failure mechanisms and risks on TSV, solder joints, warpage, metal migrations etc
- Experience in defining / driving roadmap for Photonics reliability
